The Bent Strip Method (Deposit Stress Analyzer System) is now approved as ASTM Standard B975
The Deposit Stress Analyzer is a part of the DSA System which is comprised of a Test Strip, Plating Cell, and the PN: 683 Deposit Stress Analyzer. The Test Strip has a small surface area and can be plated in the work tank or in a laboratory setting using a Plating Cell. The Plating Cell offers standard anode to cathode spacing to insure uniform current density across the Test Strip legs. After plating, the Test Strip is supported in the Deposit Stress Analyzer which measures the distance that the Test Strip legs have spread. This distance is included in a formula to calculate the deposit stress in pounds per square inch. Stress is also determined to be compressive or tensile in nature. A small permanently mountable plating cell is also available to place in working tanks.
The Deposit Stress Analyzer System can be used by all metal platers. Some applications include:
- Electroformed copper and nickel deposits.
- Military grade plated deposits.
- Hard chrome plated deposits.
- Decorative nickel chrome plated deposits.
- Electronics copper and nickel plated deposits.
- Precious metal plated deposits.
- Electroless chemically deposited metallic layers.
- Engineered metal alloy plated deposits.
The Deposit Stress Analyzer supports a plated Test Strip over a scale so the number of scale increments between the tips of the test strip can be read. The total units spread is then included in a formula to calculate the internal deposit stress in pounds per square inch. Note: the total units spread should not exceed 20 units.
The deposit stress is compressive if the resist is on the outside of the Test Strip legs.
The deposit stress is tensile if the plating is on the outside of the Test Strip legs.